rej03g0343-0200 rev.2.00 nov 30, 2007 page 1 of 6 bcr08am-12a triac low power use rej03g0343-0200 rev.2.00 nov 30, 2007 features ? i t (rms) : 0.8 a ? v drm : 600 v ? i rgti , i rgt iii : 5 ma ? planar passivation type outline 2 1 3 1. t 1 terminal 2. t 2 terminal 3. gate terminal 1 2 3 renesas package code: prss0003ea-a (package name: to-92) applications electric fan, air cleaner, and other general purpose control applications maximum ratings voltage class parameter symbol 12 unit repetitive peak off-state voltage note1 v drm 600 v non-repetitive peak off-state voltage note1 v dsm 720 v
bcr08am-12a rej03g0343-0200 rev.2.00 nov 30, 2007 page 2 of 6 parameter symbol ratings unit conditions rms on-state current i t (rms) 0.8 a commercial frequency, sine full wave 360 conduction, tc = 56 c surge on-state current i tsm 8 a 60hz sinewave 1 full cycle, peak value, non-repetitive i 2 t for fusing i 2 t 0.26 a 2 s value corresponding to 1 cycle of half wave 60hz, surge on-state current peak gate power dissipation p gm 1 w average gate power dissipation p g (av) 0.1 w peak gate voltage v gm 6 v peak gate current i gm 0.5 a junction temperature tj ? 40 to +125 c storage temperature tstg ? 40 to +125 c mass ? 0.23 g typical value notes: 1. gate open. electrical characteristics parameter symbol min. typ. max. unit test conditions repetitive peak off-state current i drm ? ? 1.0 ma tj = 125 c, v drm applied on-state voltage v tm ? ? 2.0 v tc = 25 c, i tm = 1.2 a, instantaneous measurement ? v rgt ? ? 2.0 v gate trigger voltage note2 ?? v rgt ?? ? ? 2.0 v tj = 25 c, v d = 6 v, r l = 6 ? , r g = 330 ? ? i rgt ? ? 5 ma gate trigger current note2 ?? i rgt ?? ? ? 5 ma tj = 25 c, v d = 6 v, r l = 6 ? , r g = 330 ? gate non-trigger voltage v gd 0.1 ? ? v tj = 125 c, v d = 1/2 v drm thermal resistance r th (j-c) ? ? 60 c/w junction to case note3 critical-rate of rise of off-state commutating voltage note4 (dv/dt)c 0.5 ? ? v/ s tj = 125 c notes: 2. measurement usi ng the gate trigger characteristics measurement circuit. 3. case temperature is measured at the t 2 terminal 1.5 mm away from the molded case. 4. test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below. test conditions commutating voltage and current waveforms (inductive load) 1. junction temperature tj = 125 c 2. rate of decay of on-state commutating current (di/dt)c = ? 0.4 a/ms 3. peak off-state voltage v d = 400 v supply voltage time time time main current main voltage (di/dt)c v d (dv/dt)c
bcr08am-12a rej03g0343-0200 rev.2.00 nov 30, 2007 page 3 of 6 performance curves maximum on-state characteristics on-state voltage (v) on-state current (a) rated surge on-state current conduction time (cycles at 60hz) surge on-state current (a) gate characteristics ( ii and iii) gate current (ma) gate voltage (v) gate trigger voltage vs. junction temperature junction temperature (c) gate trigger voltage (tj = tc) gate trigger voltage (tj = 25c) 100 (%) gate trigger current vs. junction temperature junction temperature (c) gate trigger current (tj = tc) gate trigger current (tj = 25c) 100 (%) maximum transient thermal impedance characteristics (junction to case, junction to ambient) conduction time (cycles at 60hz) transient thermal impedance (c/w) 10 0 25710 1 4 2 310 2 4257 34 6 8 10 3 1 5 7 9 0 4.0 1.0 1.5 3.0 3.5 2.0 2.5 10 1 7 5 3 2 10 0 7 5 3 2 10 ?1 ? 60 ? 20 ? 40 10 0 2 10 1 357 357 2357 10 2 10 3 2 7 5 10 1 2 3 3 5 7 2 3 3 5 7 10 ?1 10 2 2 3 5 7 2 3 3 5 7 10 1 23 10 ?1 5710 0 23 5 23 10 2 5710 3 10 4 23 57 10 5 23 57 710 1 23 5710 2 10 1 10 3 7 5 3 2 20 10 2 7 5 3 2 60 100 140 04080 120 10 1 10 3 7 5 3 2 20 10 2 7 5 3 2 60 100 140 04080 120 ? 60 ? 20 ? 40 tj = 25c typical example v gm = 6v i gm = 0.5a v gt i rgt i , i rgt iii v gd = 0.1v p g(av) = 0.1w typical example junction to ambient junction to case p gm = 1w
bcr08am-12a rej03g0343-0200 rev.2.00 nov 30, 2007 page 4 of 6 on-state power dissipation (w) rms on-state current (a) maximum on-state power dissipation rms on-state current (a) case temperature (c) allowable case temperature vs. rms on-state current rms on-state current (a) ambient temperature (c) allowable ambient temperature vs. rms on-state current junction temperature (c) repetitive peak off-state current (tj = tc) repetitive peak off-state current (tj = 25c) 100 (%) repetitive peak off-state current vs. junction temperature holding current vs. junction temperature junction temperature (c) holding current (tj = tc) holding current (tj = 25c) 100 (%) latching current (ma) latching current vs. junction temperature junction temperature (c) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 160 120 100 60 20 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 40 80 140 160 120 100 60 20 0 0 0.2 0.1 0.6 1.0 40 80 140 0.4 0.5 0.3 0.7 0.8 0.9 10 3 7 5 3 2 10 2 10 4 7 5 3 2 10 5 7 5 3 2 20 60 100 140 0 40 80 120 10 3 5 7 3 2 5 7 3 2 10 2 10 1 20 60 100 140 04080 120 7 5 3 2 10 2 160 04080120 ? 60 ? 20 ? 40 ? 40 ? 60 ? 20 ? 40 10 0 7 5 10 1 2 3 5 7 2 3 10 ?1 360 conduction resistive, inductive loads curves apply regardless of conduction angle 360 conduction resistive, inductive loads typical example 360 conduction resistive, inductive loads typical example distribution t 2 + , g ? typical example t 2 ? , g ? typical example natural convection no fins curves apply regardless of conduction angle resistive, inductive loads
bcr08am-12a rej03g0343-0200 rev.2.00 nov 30, 2007 page 5 of 6 rate of rise of off-state voltage (v/ s) breakover voltage (dv/dt = xv/ s) breakover voltage (dv/dt = 1v/ s) 100 (%) breakover voltage vs. rate of rise of off-state voltage breakover voltage vs. junction temperature junction temperature (c) breakover voltage (tj = tc) breakover voltage (tj = 25c) 100 (%) commutation characteristics critical rate of rise of off-state commutating voltage (v/ s) rate of decay of on-state commutating current (a/ms) gate trigger current (tw) gate trigger current (dc) 100 (%) gate current pulse width ( s) gate trigger current vs. gate current pulse width test procedure iii test procedure ii gate trigger characteristics test circuits 23 10 0 5710 1 23 5710 2 23 5710 3 120 0 20 40 60 80 100 140 160 160 100 80 40 20 0 140 60 120 20 60 100 140 0 40 80 120 ? 60 ? 20 ? 40 10 1 10 3 7 5 3 2 10 0 25710 1 10 2 7 5 3 2 310 2 4257 3 4 7 5 3 2 10 ?1 23 23 5710 0 10 1 7 5 3 2 5710 1 10 0 6 ? 6 ? 6v 6v 330 ? 330 ? a v a v 10 ?1 typical example typical example tj = 125c i quadrant iii quadrant i quadrant iii quadrant minimum characteristics value typical example tj = 125c i t = 1a = 500 s v d = 200v typical example i rgt i i rgt iii
bcr08am-12a rej03g0343-0200 rev.2.00 nov 30, 2007 page 6 of 6 package dimensions sc-43a 0.23g mass[typ.] ? prss0003ea-a renesas code jeita package code previous code unit: mm 5.0max 4.4 3.6 11.5min 5.0max 1.25 circumscribed circle 0.7 1.25 1.1 package name to-92* order code lead form standard packing quantity standard order code standard order code example straight type vinyl sack 500 type name bcr08am-12a lead form vinyl sack 500 type name ? lead forming code bcr08am-12a-a6 form a8 taping 2000 type name ? tb bcr08am-12a-tb note : please confirm the specificat ion about the shipping in detail.
notes: 1. this document is provided for reference purposes only so that renesas customers may select the appropriate renesas product s for their use. renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of renesas or any third party with respect to the information in this document. 2. renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of t he use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. you should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. when exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. all information included in this document such as product data, diagrams, charts, programs, algorithms, and application ci rcuit examples, is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas products listed in this document, please confirm the latest product information with a renesas sales office. also, please pay regular and careful attentio n to additional and different information to be disclosed by renesas such as that disclosed through our website. (http://www.renesas.com ) 5. renesas has used reasonable care in compiling the information included in this document, but renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. when using or otherwise relying on the information in this document, you should evaluate the information in light of the t otal system before deciding about the applicability of such information to the intended application. renesas makes no representations, warranties or guaranties regarding th e suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this do cument or renesas products. 7. with the exception of products specified by renesas as suitable for automobile applications, renesas products are not desi gned, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of h uman injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion co ntrol, aerospace and aeronautics, nuclear power, or undersea communication transmission. if you are considering the use of our products for such purposes, please contact a r enesas sales office beforehand. renesas shall have no liability for damages arising out of the uses set forth above. 8. notwithstanding the preceding paragraph, you should not use renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to us e renesas products in any of the foregoing applications shall indemnify and hold harmless renesas technology corp., its affiliated companies and their officers, dir ectors, and employees against any and all damages arising out of such applications. 9. you should use the products described herein within the range specified by renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas sha ll have no liability for malfunctions or damages arising out of the use of renesas products beyond such specified ranges. 10. although renesas endeavors to improve the quality and reliability of its products, ic products have specific characteristic s such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. please be sure to implement safety measures to guard against the poss ibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas product, such as safety design for hardware and software includin g but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. among others, sinc e the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. in case renesas products listed in this document are detached from the products to which the renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. you should implement safety measures so that renesas products may not be easily detached from your products. renesas shall have no liability for damages arising out of such detachment. 12. this document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from r enesas. 13. please contact a renesas sales office if you have any questions regarding the information contained in this document, renes as semiconductor products, or if you have any other inquiries. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com refer to " http://www.renesas.com/en/network " for the latest and detailed information. renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500, fax: <1> (408) 382-7501 renesas technology europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k. tel: <44> (1628) 585-100, fax: <44> (1628) 585-900 renesas technology (shanghai) co., ltd. unit 204, 205, aziacenter, no.1233 lujiazui ring rd, pudong district, shanghai, china 200120 tel: <86> (21) 5877-1818, fax: <86> (21) 6887-7858/7898 renesas technology hong kong ltd. 7th floor, north tower, world finance centre, harbour city, canton road, tsimshatsui, kowloon, hong kong tel: <852> 2265-6688, fax: <852> 2377-3473 renesas technology taiwan co., ltd. 10th floor, no.99, fushing north road, taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 3518-3399 renesas technology singapore pte. ltd. 1 harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas technology korea co., ltd. kukje center bldg. 18th fl., 191, 2-ka, hangang-ro, yongsan-ku, seoul 140-702, korea tel: <82> (2) 796-3115, fax: <82> (2) 796-2145 renesas technology malaysia sdn. bhd unit 906, block b, menara amcorp, amcorp trade centre, no.18, jln persiaran barat, 46050 petaling jaya, selangor darul ehsan, m alaysia tel: <603> 7955-9390, fax: <603> 7955-9510 renesas sales offices ? 2007. renesas technology corp., all rights reserved. printed in japan. colophon .7.2
to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation ( http://www.renesas.com ) send any inquiries to http://www.renesas.com/inquiry .
notice 1. all information included in this document is current as of th e date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas electronics products listed herein, please confirm the latest product information with a renesas electronics sales office. also, please pay regular and careful attention to additional and different information to be disclosed by renesas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electronics products or technical information described in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part . 4. descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. you should not use renesas electronics products or the technology de scribed in this document for any purpose re lating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. renesas electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or om issions from the information included herein. 7. renesas electronics products are classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product depends on the product?s quality grade, as indicated below. you must check the quality grade of each renesas electronics product before using it in a particular application. you may not use any renesas electronics product for any application categorized as ?specific? without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. renesas electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intended where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electronics data sheets or data books, etc. ?standard?: computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. ?high quality?: transportation equipment (automobiles, trains, ship s, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specifically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. you should use the renesas electronics products described in this document within the range specified by renesas electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesas electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use re nesas electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of c ontrolled substances, including without limitation, the eu rohs directive. renesas electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any fo rm, in whole or in part, without prior written consent of renes as electronics. 12. please contact a renesas electronics sales office if you have any questions regarding the information contained in this document or renesas electronics products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics.
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